AS9F18G08SA-45BIN
Description:
SPI SLC NAND 8Gb 1,8V FBGA63
Supplier:
Alliance Memory
Matchcode:
NAND0808FBGA1.8
Rutronik No.:
ICPROM10849
Unit Pack:
210
MOQ:
210
package:
FBGA63
Packaging:
TRAY
- Type
- SPI NAND
- Density
- 8G bit
- Organisation
- 1Gx8
- U(cc)
- 1.8 V
- Package
- FBGA63
- Permis.T(A)min
- -40 °C
- Permis.T(A)max
- 85 °C
- Automotive
- NO
- Stdby.curr.I(Q)
- 10uA
- RoHS Status
- RoHS-conform
- Access time
- 45 ns
- ECC
- 4BIT
- Package width
- 9x11mm
- Packaging
- TRAY
- ECCN
- EAR99
- Customs Tariff No.
- 85423269000
- Country
- South Korea
- Supplier Lead time
- 10 weeks
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