EE58-3AA2-3621-E2
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- Form factor
- SMARC
- COMe type
- NONE
- System chipset
- GENIO 700
- Socket type
- ONBOARD
- Chipset manufac
- XILINX
- Chipset techno.
- ARM
- Memory type
- LPDDR4
- Memory sockets
- ONBOARD
- Max.memory size
- 4 GB
- Onboard flash
- 32GB
- LVDS onbord
- Y Y/N
- SSD connector
- SD
- CAN bus
- Y Y/N
- I²C
- N Y/N
- Operating temp.
- -40TO+85°C
- Installed CPU
- Genio 700
- Installed DRAM
- 0 GB
- Installed Flash
- 0 GB
- Installed OS
- NONE
- Integrated WiFi
- Y Y/N
- Integrated BT
- Y Y/N
- Integr.cellular
- N Y/N
- Automotive
- NO
- RoHS Status
- RoHS-conform
- Packaging
- BOX
- ECCN
- 5A992
- Customs Tariff No.
- 84733020000
- Country
- Italy
- ABC-Code
- A
- Supplier Lead time
- 12 weeks
SMARC® Rel. 2.1.1 Computer on Module (CoM) with MediaTek Genio 700 Applications Processors
2x Arm® Cortex®-A78 @ 2.2 GHz, 6x Arm® Cortex®-A55 @ 2.0 GHz,
Mali G57 MC3 GPU
AI Accelerator: Cadence Tensilica VP6, Mediatek APU3.0
DSP: Candence Tensilica HiFi5
Image Signal Processor (ISP)
LPDDR4X-3733/LPDDR4-3200 memory, up to 8GB
LVDS Dual Channel or eDP (factory alternatives)
HDMI, DP
MIPI/eDP: up to 2560x1600p60
HDMI/DP: up to 4K60
eMMC 5.1 Drive soldered on-board, up to 64GB (boot device)
SDIO Interface
1x Gigabit Ethernet (RGMII)
1x 100Mbit Ethernet (USB)
Optional Wifi 802.11 a/b/g/n/ac 2x2 and BT 5.3 utilising onboard module with M2.1216 standard form factor
1x USB3.1
1x USB2.0 Host/Slave
4x USB2.0 Host
2x I2S port
2x UART (4-wires)
2x UART (2-wires)
GPIOs
MIPI-CSI camera interface
I2C Bus
PWM ports
Power +5VDC ± 5% and +3.3V_RTC
OS: Linux Yocto Kirkstone, Android T (13)
Commercial, Extended Commercial & Industrial Temp. Range
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