IM73D122V01XTMA1
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Datasheet
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Samples
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- Interface
- PDM
- Port location
- Bottom
- AOP
- 122 dBSPL
- SNR
- 73 dB
- Package
- LGA-5
- Automotive
- NO
- Vcc(min)
- 1.62 V
- Vcc(max)
- 3.6 V
- Icc(max)
- 980 µA
- Technology
- MEMS
- Mounting
- SMD
- Footprint
- 12 mm²
- RoHS Status
- RoHS-conform
- Packaging
- REEL
- Supplier Part
- SP005675385
- ECCN
- EAR99
- Customs Tariff No.
- 85423911000
- Country
- China
- ABC-Code
- A
- Supplier Lead time
- 25 weeks
Ultra-low noise digital XENSIVTM MEMS microphone IM73D122 is designed for applications which require a very high SNR (low self-noise) and a high sensitivity. The flat frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve performance of multi-microphone (array) applications. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level.
The powerful mix of ultra-high SNR and high sensitivity empowers high quality audio capturing for voice user interface applications in laptops, tablets or conferencing devices.
Features
- Ultra-low self-noise/ultra-high SNR 73dB(A)
- Very high sensitivity (-26 dBFS)
- Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
- High dynamic range and acoustic overload point (AOP) of 122 dBSPL
- Very tight part-to-part phase and sensitivity matching (± 1dB)
- Flat frequency response with a low LFRO (low frequency roll-off) of 20Hz
- Very low group delay (7µs @ 1kHz)
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